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Fabrication Specifications

Part # Rev

BOARD TYPE Number of Layers Width Length

ARRAY SIZE Width Lenght # Up

GOLD None Connection Immersion
Bondable Selective Sq. inch

LAMINATED MATERIAL FR-4,FR-4 Polymide
CEM-1 EEM-3
Other

BOARD THICKNESS .020 .031 .062 Other

COPPER LAYER inner .5 oz. 1 oz 2 oz Other
COPPER LAYER outer .5 oz. 1 oz 2 oz Other

SILK SCREEN One Side Two Side None

SOLDER MASK TYPE None LPI Other

HOLES Quantity No. of Sizes
Smallest Via Pad Size

SMT None One Side Two Side
Quantity Smallest Pitch

ELECTRICAL TEST YES NO
BOARD FINISH SMOBC Entek Immersion Gold
immersion Silver Other

ARTWORK GERBER Film Other

DENSITY Line width Space Width

SPECS MIL IPC Other

SPECIAL Web Route Controlled/Impedence Blind/Buried Vias

Quantity Required
Required delivery by

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