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Fabrication Specifications

Part #
Rev
BOARD TYPE
Number of Layers
Width
Length
ARRAY SIZE
Width
Length
# Up
GOLD
 None Connection Immersion Bondable Selective Sq. inch
LAMINATED MATERIAL
 None FR-4,FR-4 Polymide CEM-1 EEM-3 Other
BOARD THICKNESS
 None .020 .031 .062 Other
COPPER LAYER inner
 None .5 oz. .1 oz. .2 oz. Other
COPPER LAYER outer
 None .5 oz. .1 oz. .2 oz. Other
SILK SCREEN
 None One Side Two Side Other
SOLDER MASK TYPE
 None LPI Other
HOLES
Quantity
No. of Sizes
Smallest
Via Pad Size
SMT
 None One Side Two Side
Quantity
Smallest Pitch
ELECTRICAL TEST
 Yes No
BOARD FINISH
 SMOBC Entek Immersion Gold immersion Silver Other
ARTWORK
 GERBER Film Other
DENSITY
Line width
Space Width
SPECS
 MIL IPC Other
SPECIAL
 Web Route Controlled/Impedence Blind/Buried Vias
Quantity Required
Required delivery by