Year |
2006 |
2007 |
2008 |
2009 |
Line width
(Hoz base) |
0.1mm
(4 mil) |
0.075mm
(3 mil) |
0.06mm
(2.3mil) |
0.04mm
(1.6mil) |
Copper thickness
(finished) |
4oz |
5oz |
6oz |
7oz |
Layer |
8L |
14L |
20L |
32L |
Thickness |
2.4mm |
3.2mm |
4.0mm |
4.5mm |
HDI
(buried&blind hole) |
-- |
1+N+1 |
2+N+2 |
Stack via |
Rigid fles |
Flex –under developing
(2L) |
Flex rigid flex
(4L) |
Rigid flex
(4L) |
Rigid flex
(6L~8L) |
Surface treatent |
Lead Free HASL
Emersion Gold& silver & Tin , OSP,
|
|
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Aspect ratio |
6 |
10 |
12 |
14 |
Material |
FR-4 Tg140,150,180 |
FR-4 Halogen Free |
Poly Imid
Teflon |
Composite material |
Existing production status (1)
Existing production status (2)
Existing production status (3)
Existing production status (4)
Please contact us at our USA office with any questions or comments:
Circuit Engineering L.L.C.
511 S. Vista Ave
Addison, IL 60101
Phone: (630) 628-9923
Fax: (630) 628-9923
email: sales@circuiteng.com
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